Hot Deformation and Dynamic Recrystallization Behavior of CoCrNi and (CoCrNi)<sub>94</sub>Ti<sub>3</sub>Al<sub>3</sub> Medium Entropy Alloys
Hai-long Yi,
Daixiu Wei,
Yingchen Wang,
Liqiang Wang,
Ming-yang Fang,
Kang Yang,
Hidemi Kato
Affiliations
Hai-long Yi
State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang 110819, China
Daixiu Wei
Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Sendai, Miyagi 980-8577, Japan
Yingchen Wang
State Key Laboratory of Metal Matrix Composites, School of Material Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Road, Shanghai 200240, China
Liqiang Wang
State Key Laboratory of Metal Matrix Composites, School of Material Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Road, Shanghai 200240, China
Ming-yang Fang
State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang 110819, China
Kang Yang
State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang 110819, China
Hidemi Kato
Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Sendai, Miyagi 980-8577, Japan
The CoCrNi and precipitate-hardened (CoCrNi)94Ti3Al3 medium entropy alloys (MEAs) have attracted much attention, due to their exceptional mechanical properties, whereas the hot deformation characteristics have not been revealed. In the present study, we investigated the dynamic recrystallization behavior and microstructure evolutions of the two MEAs hot-compressed at single-phase temperatures. The constitutive equation was obtained, and microstructures were observed. Discontinuous dynamic recrystallization acted as a key mechanism of grain refinement at a relatively higher temperature and lower strain rate, which leads to the formation of a homogeneous grain structure. The addition of Ti and Al promoted dynamic recrystallization due to the solid solution hardening effect. The results provide valuable guidelines for microstructure refinement via thermomechanical processing.
