Electrochemical and wetting behavior of as-cast Sn-Zn-Sb lead free solders alloys

Abstract

Ternary alloys SnZn12Sb8, SnZn10Sb10, SnZn8Sb12, SnZn6Sb14, and SnZn2Sb18 were prepared by induction melting. Electrochemical behavior and wetting (contact angle) of prepared as-cast samples were investigated using open circuit potential measurement and sessile drop technique. The results of electrochemical investigation show that open-circuit potential, few seconds after immersing of electrodes, shifts toward more negative values, indicating a relatively smaller rate of dissolution during the spontaneous dissolution process under the curentless conditions. After that period, the values of potential tend to be constant with time. It was found that all investigated alloys have poor wettability on copper substrate and the contact angle values decrease with increasing superheat temperature.

Keywords

• open-circuit potential
• contact angle
• step soldering alloys
• sessile drop technique