Equipment for ohmic contacts formation in semi-conductor devices based on А3В5 connections

Abstract

Technological process features of ohmic contacts formation in semi-conductor devices based on А3В5 connections and the general principles of technological modules construction are considered. The results received by means of installations of an electron-beam evaporation of STE EB series and installations of fast thermal annealing of STE RTA series are shown.

Keywords

• semiconductor devices
• ohmic contacts
• electron-beam evaporation