Journal of the Mechanical Behavior of Materials (Jun 1999)

Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation

Zhao, Y.,
Basaran, C.,
Cartwright, A.,
Dishongh, T.

Affiliations

Zhao, Y.
Basaran, C.
Cartwright, A.
Dishongh, T.

DOI: https://doi.org/10.1515/JMBM.1999.10.3.135
Journal volume & issue: Vol. 10, no. 3
pp. 135 – 146

Abstract

No abstracts available.

Published in Journal of the Mechanical Behavior of Materials

ISSN: 0334-8938 (Print); 2191-0243 (Online)
Publisher: De Gruyter
Country of publisher: Poland
LCC subjects: Technology: Mechanical engineering and machinery
Website: https://www.degruyter.com/view/j/jmbm

About the journal