Study Of Quality And Reliability Of Welding Process Reflow Component Technology BGA

Abstract

In recent years many efforts have been expended by companies in the search for technological improvement of its products by adding features such as light weight, reduced size and high levels of performance at the lowest cost, to meet a worldwide demand in this regard. This article aimed to conduct an analysis of the quality and reliability of the Reflow soldering process of component of BGA technology. The methods and techniques used were the qualitative-quantitative approach, conducted by the case study technic in the welding process of the BGA component by collecting (cross section and X-ray) and data analysis (alignment, cracks and voids) within the process. The achieved results showed that the Reflow welding process of BGA component meets the criteria for acceptance of international standards IPC -A - 610E and IPC 7095B. This fact leads to the inference that the quality of the process in question may reflect in better conditions and cost competitiveness for the investigated organization.

Keywords

• Quality in process
• Reflow soldering
• BGA component
• Cross section
• Cracks and Voids