Micro and Nano Engineering (Jun 2023)

Water-soluble bio-sourced resists for DUV lithography in a 200/300 mm pilot line environment

  • Isabelle Servin,
  • Alexandre Teolis,
  • Arnaud Bazin,
  • Paule Durin,
  • Olha Sysova,
  • Corinne Gablin,
  • Benoît Saudet,
  • Didier Leonard,
  • Olivier Soppera,
  • Jean-Louis Leclercq,
  • Yann Chevolot,
  • Raluca Tiron,
  • Thierry Delair,
  • Stéphane Trombotto

Journal volume & issue
Vol. 19
p. 100202

Abstract

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Water-based bio-sourced resists are promising candidates as alternatives for deep ultraviolet (DUV) lithography by replacing current photoresists issued from petro-chemistry for microelectronics application. Chitosan films produced from seafood industry wastes enable patterning processes free of organic solvent and alkali-based developers, by substitution with water. After demonstrating high-resolution patterning at lab-scale after transfer into silica 10 mm wafer, we investigate here the industrial pre-transfer chitosan-based photoresist on the 300 mm pilot line scale at CEA-Leti for 193 nm DUV lithography.

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