Micromachines (Feb 2022)

Numerical Analysis of Multi-Angle Precision Microcutting of a Single-Crystal Copper Surface Based on Molecular Dynamics

  • Jianhe Liu,
  • Liguang Dong,
  • Junye Li,
  • Kun Dong,
  • Tiancheng Wang,
  • Zhenguo Zhao

DOI
https://doi.org/10.3390/mi13020263
Journal volume & issue
Vol. 13, no. 2
p. 263

Abstract

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The molecular dynamics method was used to study the removal mechanism of boron nitride particles by multi-angle microcutting of single-crystal copper from the microscopic point of view. The mechanical properties and energy conversion characteristics of single-crystal copper during microcutting were analyzed and the atomic displacement and dislocation formation in the microcutting process are discussed. The research results showed that during the energy transfer between atoms during the microcutting process of boron nitride particles, the crystal lattice of the single-crystal copper atom in the cutting extrusion region was deformed and displaced, the atomic temperature and thermal motion in the contact area between boron nitride particles and Newtonian layer of workpiece increased, the single-crystal copper atom lattice was defective, and the atomic arrangement structure was destroyed and recombined. The interface of different crystal structures formed a dislocation structure and produced plastic deformation. With the increase of the impact cutting angle, the dislocation density inside the crystal increased, the defect structure increased and the surface quality of the workpiece decreased. To protect the internal structure of the workpiece and improve the material removal rate, a smaller cutting angle should be selected for the abrasive flow microcutting function, which can reduce the formation of an internal defect structure and effectively improve the quality of abrasive flow precision machining. The research conclusions can provide a theoretical basis and technical support for the development of precision abrasive flow processing technology.

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