APL Photonics (Mar 2024)

Hybrid material integration for active photonic applications

  • Chengyu Chen,
  • Yuping Chen,
  • Zhifan Fang,
  • Rui Ge,
  • Jiangwei Wu,
  • Xianfeng Chen

DOI
https://doi.org/10.1063/5.0187924
Journal volume & issue
Vol. 9, no. 3
pp. 030903 – 030903-19

Abstract

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The huge development of micro-/nano-manufacturing techniques on different materials has greatly expanded the possibilities of realizing on-chip multifunctional devices on photonic integrated circuits. In recent years, we have witnessed technological advancements, such as active photonic applications through hybrid integration. In this Perspective, we first summarize the integrated photonic materials, hybrid integration technologies, and corresponding coupling techniques in hybrid integration and give the technique prospects. We also introduce significant advances in hybrid integration technologies for active photonic applications, such as laser sources, optical frequency combs, and modulators, and give our views that are likely to develop rapidly. Finally, we discuss the challenges in hybrid technologies and photonic applications.