Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG)

Abstract

Many hydrophobic metal coatings onto Aluminum have been studied in recent years because of their significant potential applications. Unfortunately, most of them lost the original metallic luster due to the micro/nano binary structures. In this paper, a facile method was developed to prepare a hydrophobic and high-glossy copper coating onto aluminum substrates. The wettability and gloss could be tuned by the value of current density. With the increase of current deensity, the surface roughness raised, thus resulting in increase of contact angle and decrease of glossiness. When the current density was less than 1 mA/cm2, the coating exhibited good luster and prefered orientation. Lowering the Current density the coating showed different corrossion resistance and good water reppelence.