In Search of the Driving Factor for the Microwave Curing of Epoxy Adhesives and for the Protection of the Base Substrate against Thermal Damage

Abstract

This study used controlled microwaves to elucidate the response of adhesive components to microwaves and examined the advantages of microwave radiation in curing epoxy adhesives. Curing of adhesives with microwaves proceeded very rapidly, even though each component of the adhesive was not efficiently heated by the microwaves. The reason the adhesive cured rapidly is that microwave heating was enhanced by the electrically charged (ionic) intermediates produced by the curing reaction. In contrast, the cured adhesive displayed lower microwave absorption and lower heating efficiency, suggesting that the cured adhesive stopped heating even if it continued to be exposed to microwaves. This is a definite advantage in the curing of adhesives with microwaves, as, for example, adhesives dropped onto polystyrene could be cured using microwave heating without degrading the polystyrene base substrate.

Keywords

• microwave
• epoxy adhesive
• thermal damage
• microwave-assisted curing
• penetration depth
• electric field