Wafer-Level Vacuum-Packaged Translatory MEMS Actuator with Large Stroke for NIR-FT Spectrometers

Abstract

We present a wafer-level vacuum-packaged (WLVP) translatory micro-electro-mechanical system (MEMS) actuator developed for a compact near-infrared-Fourier transform spectrometer (NIR-FTS) with 800–2500 nm spectral bandwidth and signal-nose-ratio (SNR) > 1000 in the smaller bandwidth range (1200–2500 nm) for 1 s measuring time. Although monolithic, highly miniaturized MEMS NIR-FTSs exist today, we follow a classical optical FT instrumentation using a resonant MEMS mirror of 5 mm diameter with precise out-of-plane translatory oscillation for optical path-length modulation. Compared to highly miniaturized MEMS NIR-FTS, the present concept features higher optical throughput and resolution, as well as mechanical robustness and insensitivity to vibration and mechanical shock, compared to conventional FTS mirror drives. The large-stroke MEMS design uses a fully symmetrical four-pantograph suspension, avoiding problems with tilting and parasitic modes. Due to significant gas damping, a permanent vacuum of ≤3.21 Pa is required. Therefore, an MEMS design with WLVP optimization for the NIR spectral range with minimized static and dynamic mirror deformation of ≤100 nm was developed. For hermetic sealing, glass-frit bonding at elevated process temperatures of 430–440 °C was used to ensure compatibility with a qualified MEMS processes. Finally, a WLVP MEMS with a vacuum pressure of ≤0.15 Pa and Q ≥ 38,600 was realized, resulting in a stroke of 700 µm at 267 Hz for driving at 4 V in parametric resonance. The long-term stability of the 0.2 Pa interior vacuum was successfully tested using a Ne fine-leakage test and resulted in an estimated lifetime of >10 years. This meets the requirements of a compact NIR-FTS.

Keywords

• micro-opto-electro-mechanical system (MOEMS)
• translatory micro mirror
• optical wafer-level vacuum package (WLVP)
• NIR Fourier-transform spectrometer
• glass-frit wafer bonding