Metals (May 2017)

Transparent Conducting Film Fabricated by Metal Mesh Method with Ag and Cu@Ag Mixture Nanoparticle Pastes

  • Hyun Min Nam,
  • Duck Min Seo,
  • Hyung Duk Yun,
  • Gurunathan Thangavel,
  • Lee Soon Park,
  • Su Yong Nam

DOI
https://doi.org/10.3390/met7050176
Journal volume & issue
Vol. 7, no. 5
p. 176

Abstract

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Transparent conducting electrode film is highly desirable for application in touch screen panels (TSPs), flexible and wearable displays, sensors, and actuators. A sputtered film of indium tin oxide (ITO) shows high transmittance (90%) at low sheet resistance (50 Ω/cm2). However, ITO films lack mechanical flexibility, especially under bending stress, and have limitation in application to large-area TSPs (over 15 inches) due to the trade-off in high transmittance and low sheet resistance properties. One promising solution is to use metal mesh-type transparent conducting film, especially for touch panel application. In this work, we investigated such inter-related issues as UV imprinting process to make a trench layer pattern, the synthesis of core-shell-type Ag and Cu@Ag composite nanoparticles and their paste formulation, the filling of Ag and Cu@Ag mixture nanoparticle paste to the trench layer, and touch panel fabrication processes.

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