ACS Omega
(Feb 2024)
Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions
- Cheng Zhang,
- Zhe Xu,
- Yingxuan Huang,
- Yuefeng Li,
- Yang Li,
- Bobo Yang,
- Rongrong Hu,
- Jun Zou,
- Changran Zheng,
- Qi Qian
Affiliations
- Cheng Zhang
- School of Science, Shanghai Institute of Technology, Shanghai, China
- Zhe Xu
- School of Science, Shanghai Institute of Technology, Shanghai, China
- Yingxuan Huang
- School of Science, Shanghai Institute of Technology, Shanghai, China
- Yuefeng Li
- School of Science, Shanghai Institute of Technology, Shanghai, China
- Yang Li
- School of Materials Science and Engineering, Shanghai Institute of Technology, Shanghai, China
- Bobo Yang
- School of Science, Shanghai Institute of Technology, Shanghai, China
- Rongrong Hu
- School of Science, Shanghai Institute of Technology, Shanghai, China
- Jun Zou
- School of Science, Shanghai Institute of Technology, Shanghai, China
- Changran Zheng
- Academy for Engineering and Technology, Fudan University, Shanghai, China
- Qi Qian
- Zhejiang Silanex Technology (Taizhou) Co., Ltd., Taizhou, Zhejiang, China
- DOI
-
https://doi.org/10.1021/acsomega.3c08950
- Journal volume & issue
-
Vol. 9,
no. 10
pp.
11637
– 11645
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