Facile synthesis of Cu10Sn3 nanoparticles and their sintering behavior for power device packaging

Abstract

AbstractLow temperature nanojoining and high temperature service in the microelectronic packaging technology has received much focused attention. Here, we suggest a facile thermal decomposition method for preparation of Cu10Sn3 nanoparticles (NPs) with high bulk melting point (640 ​°C) by using common organic salts, oleylamine (OLA), and oleic acid (OA). The uniform and dense sintered Cu/Cu10Sn3/Cu joints can obtain at 300 ​°C, 10 ​MPa, 20 ​min, which presents the average shear strength of 25.1 ​MPa. In addition, the interdiffusion of Sn and Cu atoms at interface between the sintered Cu10Sn3 layer and Cu makes the interface a metallurgical bonding. This sintered Cu/Cu10Sn3/Cu joints can provide a new interconnect material and technology for high-power device package.

Keywords

• Cu10Sn3 alloy
• Nanoparticle synthesis
• Microstructure
• Electronic packaging
• Mechanical properties
• Sintering