The Influence of Application Protocol of Simplified and Universal Adhesives on the Dentin Bonding Performance

Abstract

Contemporary adhesives use etch-and-rinse, self-etch, and multimode adhesive strategies. Simplified and universal adhesives present lower bond strength to dentin than conventional, two-bottle etch-and-rinse adhesives. The purpose of this study was to evaluate bonding performance of simplified and universal adhesives to dentin after modifying their application protocol (multiplying applications and extending application time). Adhesive layer thickness (ALT) and shear bond strength (SBS), as well as the correlation between these parameters was calculated. Two universal (Single Bond Universal and Prime & Bond One Select) and two self-etch adhesives (Adper Easy One and Xeno V) were tested. Significant differences in ALT were detected between the adhesives, as well as within the same adhesive between study groups. Tested adhesives presented the thinnest adhesive layer when applied 2 times in 20 s. Single Bond Universal obtained the highest SBS results of all adhesives. Most adhesives (except for Prime & Bond One Select) obtained the highest SBS, when applied two or three times in 40 or 60 s, respectively. No correlation between the ALT and SBS was found. The study showed that increasing the number of applications and extending the application time of self-etch and universal adhesives can be recommended to improve their performance.

Keywords

• dental adhesives
• adhesion
• self-etch
• universal adhesive
• bond strength
• dentin
• scanning electron microscopy
• adhesive layer