Grain characteristics, electrical conductivity, and hardness of Zn-doped Cu–3Si alloys system

Abstract

Abstract The grain characteristics, electrical conductivity, hardness, and bulk density of Cu–3Si–(0.1—1 wt%)Zn alloys system fabricated by gravity casting technique were investigated experimentally using optical microscopy (OM), scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS). The study established the optimal alloy composition and the significance of zinc addition on the tested properties using response surface optimal design (RSOD). The cooled alloy samples underwent normalizing heat treatment at 900 °C for 0.5 h. The average grains size and grains distribution were analyzed using the linear intercept method (ImageJ). The microstructure examination revealed a change in grain characteristics (morphology and size) of the parent alloy by addition of 0.1 wt% zinc. The average grains size of the parent alloy decreased from 12 µm to 7.0 µm after 0.1 wt% zinc addition. This change in grain characteristics led to an increase in the hardness of the parent alloy by 42.2%, after adding 0.1 wt% zinc. The electrical conductivity of the parent alloy decreased from 46.3%IACS to 45.3%IACS, while the density was increased by 8.4% after adding 0.1 wt% zinc. The statistical data confirmed the significance of the change in properties. The result of optimization revealed Cu–3Si–0.233Zn as the optimal alloy composition with optimal properties. The Cu–3Si–xZn alloy demonstrated excellent properties suitable for the fabrication of electrical and automobile components.

Keywords

• Copper-based alloys
• Grain characteristics
• Hardness
• Electrical conductivity
• Bulk density