ACS Omega
(Mar 2020)
Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating
- Jing Li,
- Guoyun Zhou,
- Yan Hong,
- Chong Wang,
- Wei He,
- Shouxu Wang,
- Yuanming Chen,
- Zesheng Wen,
- Quanyong Wang
Affiliations
- Jing Li
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, P. R. China
- Guoyun Zhou
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, P. R. China
- Yan Hong
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, P. R. China
- Chong Wang
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, P. R. China
- Wei He
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, P. R. China
- Shouxu Wang
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, P. R. China
- Yuanming Chen
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, P. R. China
- Zesheng Wen
- Ganzhou Sun&Lynn Circuit Co. Ltd., Ganzhou, P. R. China
- Quanyong Wang
- Ganzhou Sun&Lynn Circuit Co. Ltd., Ganzhou, P. R. China
- DOI
-
https://doi.org/10.1021/acsomega.9b03691
- Journal volume & issue
-
Vol. 5,
no. 10
pp.
4868
– 4874
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