Cailiao gongcheng (Oct 2020)

Curing model and process parameters of cyanate ester resin based adhesives for spacecraft

  • HE Duan-peng,
  • GAO Hong,
  • XING Yan,
  • LI Yan,
  • WANG Xiang-ke

DOI
https://doi.org/10.11868/j.issn.1001-4381.2019.000931
Journal volume & issue
Vol. 48, no. 10
pp. 60 – 67

Abstract

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The non-isothermal reaction kinetics of cyanate ester system was investigated by dynamic differential scanning calorimetry (DSC). The analysis of non-isothermal data was carried out by using the model-fitting Kissinger, Flynn-Wall-Ozawa, and Crane methods. The results indicate that the apparent activation energy of the curing reaction is 101.3 kJ·mol-1 and 99.4 kJ·mol-1calculated from Kissinger and Flynn-Wall-Ozawa models, respectively. The reaction sequence of the adhesive is 0.92 calculated from Crane model. In addition, the relationship of the curing degree with the curing temperature and the curing time is established. The curing parameters are obtained by adopting "T-β" and "t-β" extrapolation, and the strength test proves the validity of the curing parameters designed in this paper. These results constitute a theoretical basis for the curing and application of the cyanate ester adhesives.

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