Kongzhi Yu Xinxi Jishu (Jan 2011)
Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly
Abstract
It introduces the mechanism of ultrasonic wire bonding, analyzes the material properties and the interface characteristics of the bonding for high-power IGBT module, and discusses the effects of bonding parameters on bonding strength. Several detection methods of bonding points’ strength are recommended, the parameters are further adjusted through the test results, so that the optimal wire bonding process of high-power IGBT modules can be achieved.
