AIP Advances (Jan 2024)

Analysis of multilayered shielding panels consisting of conducting and absorbing materials

  • Jong Hwa Kwon,
  • Hyun Ho Park

DOI
https://doi.org/10.1063/9.0000672
Journal volume & issue
Vol. 14, no. 1
pp. 015050 – 015050-5

Abstract

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This paper proposes a multilayered panel consisting of conducting and absorbing layers to improve the shielding performance of conducting panels, which is severely reduced by unintentional openings or gaps in the conducting plates of shielding enclosures or facilities. An analytic solution for a two-dimensional approximated structure with dielectric or magnetic absorbing materials between upper and lower conducting plates with a slit is also presented. The penetrated electric fields are examined in terms of the size of the slits, the thickness of the absorbing layer, and the offset between the two slits. For verification, the results are compared with those obtained through three-dimensional numerical simulation using CST Microwave Studio.