Study of Metal Recovery from Printed Circuit Boards by Physical-Mechanical Treatment Processes

Abstract

The acceleration of the global production and consumption of electronic devices and the concerns related to waste electrical and electronic equipment (WEEE) motivated this research. Printed circuit boards (PCB) can be found in almost all types of electronic devices, and their composition contains heavy metals that can cause environmental impacts due to improper disposal. However, on the other hand, there are elements with added value, such as copper, gold, silver, iron, aluminum and other critical raw materials, such as tantalum, that can be recovered. Metal recovery can conserve natural resources since it prevents new minerals from being extracted, being a great contribution to the circular economy. In this research, the PCB element composition was initially determined through the scanning electron microscope analysis. Then, the PCB was shredded in a cutting mill and classified in grain size classes by sieving. Afterwards, magnetic separation has been performed together with gravity and electrostatic separation of the non-magnetic fraction. In gravity separation, the metal recovery was satisfactory for the particle size −0.6 + 0.3 mm and for the particle size −1.18 + 0.6 mm. In electrostatic separation, the efficiencies obtained were higher for the smaller particle size (−0.3 mm).

Keywords

• printed circuit board (PCB)
• physical-mechanical separation
• metal recovery