IEEE Access (Jan 2021)
A Temperature Stable Amplifier Characteristics of AlGaN/GaN HEMTs on 3C-SiC/Si
Abstract
A high temperature stable amplifier characteristics for L-band or 2 GHz was studied using AlGaN/GaN high electron mobility transistors (HEMTs) on 3C-SiC/Si substrate. A crack free, high quality AlGaN/GaN heterostructure on a 6-inch Czochralski (Cz)-Si substrate was realized by metal oxide chemical vapor deposition (MOCVD). The epitaxial structure comprises an $8~\mu \text{m}$ thick nitride layer and a $1~\mu \text{m}$ thick 3C-SiC intermediate layer. The fabricated AlGaN/GaN HEMT achieved excellent electron transport characteristics along with a comparable cutoff frequency ( ${f}~_{\text {T}}$ ) of 4.8 GHz for $2~\mu \text{m}$ gate length device. Temperature dependent S-parameter measurement of open pad structures achieved outstanding temperature stability up to $125~^\circ \text{C}$ . Continuous wave power measurements showed a 2 GHz continuous wave power density of 2 W/mm, a maximum power added efficiency (PAE) of 47% along with a linear gain of 17.2 dB for class A amplifier operation. Moreover, at elevated temperature of up to $125~^\circ \text{C}$ , the minimal power performance degradation was mainly attributed to the intrinsic property of the device, thus elimination of RF leakage from the buffer or epitaxial layers at high temperatures was confirmed.
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