Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
Ganglong Li,
Zhiyi Li,
Junjie Li,
Houya Wu
Affiliations
Ganglong Li
School of Mechanical and Electronic Engineering, East China University of Technology, Nanchang 330013, China
Zhiyi Li
State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
Junjie Li
Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
Houya Wu
State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling efficiency by pre-setting metal particles in microvias and later electroplating the Cu to fill the gaps among the pre-settled particles. Since these particles occupy a certain volume in the microvia, less electroplating Cu is needed for microvia filling, leading to a shorter electroplating period.
