Case Studies in Thermal Engineering (Jun 2024)
The integration of double-layer triangular micro-channel in three-dimensional integrated circuits for enhancing heat transfer performance
Abstract
This paper proposed a new heat dissipation structure called double-layer triangular micro-channel (DLTMC) to solve the increasingly serious thermal problem of three-dimensional integrated circuits (3D-ICs). The matrix equation of heat transmission is established to derive steady-state temperature of 3D-ICs with embedded DLTMC, which is based on equivalent thermal resistance network. According to proposed computation thermal model, the heat transfer performances of 3D-ICs with embedded DLTMC concerning different cooling liquids are investigated, where the impacts of different bottom angle of DLTMC, volume concentration of nanofluid and flow velocity of cooling liquid are considered. The results show that the proposed DLTMC structure can significantly reduce steady-state temperature compared with conventional structure of single layer rectangular micro-channel (SLRMC), the corresponding steady-state temperature for them can be reduced over 32.098 %. Besides, it is demonstrated that the steady-state temperature for MWCNT-water and SWCNT-water nanofluids as cooling liquids can be reduced by 22.490 % and 19.801 % than conventional water case, respectively. Moreover, it is manifested that the increase of bottom angle of DLTMC, volume concentration of nanofluid and flow velocity of cooling liquid can evidently improve heat transfer performance of 3D-ICs. Therefore, the presented results in this paper are beneficial for solving complex thermal problems of 3D-ICs.
