Synthesis and Properties of High Temperature Resistant Poly (m-diethynylbenzene-methylsilane-phenylsilane) Resin

Abstract

Poly (m-diethynylbenzene-methylsilane-phenylsilane)(PDMP), the heat-resistant silicon-alkyne resin, was synthesized from m-diethynylbenzene, methylsilane and phenylsilane by the method of Grignard reagent. FT-IR, NMR and GPC were selected to characterize the structure of PDMP resin. The curing behavior was analyzed by DSC and rheometer, and heat performance was measured by TGA. The study shows that heat-resistant of resins first increases and then decrease with the increase of mole ratio of phenylsilane and methylsilane. When the mole ratio comes to 7:4, PDMP's heat-resistant is the best. And the Td5 (5% mass loss temperature) and residual are respectively 654℃ and 90.3% in N2, 574℃ and 34.0% in air after 1000℃.

Keywords

• mole ratio
• silicon-alkyne resin
• curing
• heat-resistant