Instruments (Oct 2021)

Fabrication of a Hydrogenated Amorphous Silicon Detector in 3-D Geometry and Preliminary Test on Planar Prototypes

  • Mauro Menichelli,
  • Marco Bizzarri,
  • Maurizio Boscardin,
  • Mirco Caprai,
  • Anna Paola Caricato,
  • Giuseppe Antonio Pablo Cirrone,
  • Michele Crivellari,
  • Ilaria Cupparo,
  • Giacomo Cuttone,
  • Silvain Dunand,
  • Livio Fanò,
  • Omar Hammad Alì,
  • Maria Ionica,
  • Keida Kanxheri,
  • Matthew Large,
  • Giuseppe Maruccio,
  • Anna Grazia Monteduro,
  • Francesco Moscatelli,
  • Arianna Morozzi,
  • Andrea Papi,
  • Daniele Passeri,
  • Marco Petasecca,
  • Silvia Rizzato,
  • Alessandro Rossi,
  • Andrea Scorzoni,
  • Leonello Servoli,
  • Cinzia Talamonti,
  • Giovanni Verzellesi,
  • Nicolas Wyrsch

DOI
https://doi.org/10.3390/instruments5040032
Journal volume & issue
Vol. 5, no. 4
p. 32

Abstract

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Hydrogenated amorphous silicon (a-Si:H) can be produced by plasma-enhanced chemical vapor deposition (PECVD) of SiH4 (silane) mixed with hydrogen. The resulting material shows outstanding radiation hardness properties and can be deposited on a wide variety of substrates. Devices employing a-Si:H technologies have been used to detect many different kinds of radiation, namely, minimum ionizing particles (MIPs), X-rays, neutrons, and ions, as well as low-energy protons and alphas. However, the detection of MIPs using planar a-Si:H diodes has proven difficult due to their unsatisfactory S/N ratio arising from a combination of high leakage current, high capacitance, and limited charge collection efficiency (50% at best for a 30 µm planar diode). To overcome these limitations, the 3D-SiAm collaboration proposes employing a 3D detector geometry. The use of vertical electrodes allows for a small collection distance to be maintained while preserving a large detector thickness for charge generation. The depletion voltage in this configuration can be kept below 400 V with a consequent reduction in the leakage current. In this paper, following a detailed description of the fabrication process, the results of the tests performed on the planar p-i-n structures made with ion implantation of the dopants and with carrier selective contacts are illustrated.

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