Effect of urea formaldehyde resin reinforced with sodium carboxymethylcellulose (Na- CMC) on particleboard properties and formaldehyde emission

Abstract

Formaldehyde-containing urea formaldehyde (UF), widely used in the production of wood-based composite boards, and modified or reinforced with various additives, determines performance. In this study, urea formaldehyde (UF) was used as an adhesive in the production of particleboard by being reinforced with sodium carboxymethylcellulose (Na-CMC) because of its adhesion, low cost and environmental friendliness and binding properties. In the study, 45% hardwood and 55% softwood chips were used as raw materials. Test boards were produced by adding 10%, 20%, 30% and 40% Na-CMC to UF glue. They were produced by using 10% urea formaldehyde (UF) resin in the surface layers and 8% in the middle layer based on dry chip weight. The Na-CMC addition to the UF glue did not have linear inclined effects on the emission of formaldehyde and the particleboard properties. It was found that the average modulus of elasticity of the boards containing 10% Na-CMC increased by 6.65%, that 20% and 30% Na-CMC addition significantly reduced free formaldehyde emission and all other properties were adversely affected. It has also been understood that all panel groups are in conformity with the TS EN 312 standard requirements for mechanical properties for general purpose plates (Type P1) used in dry conditions.

Keywords

• yonga levha
• na-cmc
• formaldehit emisyonu
• fiziksel ve mekanik özellikler
• na-cmc
• particleboard
• formaldehyde emission
• physical and mechanical properties