Active and Passive Electronic Components (Jan 1976)

The Direct Bonding of Metals to Ceramics and Application in Electronics

  • R. E. Moore,
  • G. Flanagan,
  • C. A. Neugebauer,
  • J. F. Burgess

DOI
https://doi.org/10.1155/APEC.2.233
Journal volume & issue
Vol. 2, no. 4
pp. 233 – 240

Abstract

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