A Review of the Thermal Phase Change Materials (PCM) and Metal Foams for Electronic Chips Cooling

Abstract

Heat sinks, a type of heat exchanger used due to the simplicity of fabrication, low cost, and reliable heat dissipation, are widely employed to cool electronic devices. In recent decades, heat dissipation has remained a critical challenge in optimizing the thermal performance of heat sinks. Therefore, to ensure optimal performance and reliability, effective heat removal from these devices is essential across various operational conditions. This comprehensive review examines various methods for enhancing the thermal design of heat sinks. It includes investigations into both passive and active techniques that modify the solid or fluid domain to improve heat removal. The study encompasses different approaches, focusing on perforated plate-fin heat sinks, phase change materials (PCM) enhanced by metal foam, active cooling techniques, and cost optimization. The literature revealed a strong preference for plate fins as the primary heat sink design, comprising 70% of the investigated studies. Pin fins were utilized in 15% of cases, while a hybrid configuration incorporating both plate and pin fins was observed in the remaining 15%. The integration of fins with the chosen PCM significantly accelerated the melting process, leading to an average improvement in thermal performance. The composite incorporating foam and PCM demonstrated a substantial improvement in thermal conductivity. This study aims to summarize existing research efforts, identify limitations, and explore potential solutions for advancing the thermal performance of heat sinks.

Keywords

• Heat sink, Fins, PCM, Metal foam, Thermal performance