Structural Mechanism of Performance Loss of Copper Coolers of Glass Production with Thermal Diffusion Protective Layer

Abstract

A general assessment of options for increasing the resistance of elements of heat-removing devices made of copper is carried out. The peculiarity of high-temperature corrosion destruction of thermal diffusion aluminum- containing protective layer on M1 grade copper as the most common cause of loss of efficiency is studied. The proposed mechanism for the destruction of the thermal diffusion protective layer on the lamellar element of a cooler of glass production is shown, which is caused by two competing processes — layer “resorption” and structural changes during phase interaction. The mechanical destruction features of the protective layer are studied during pure bending and the formation of penetrating cracks deep into the product. The elastoplastic properties of the main structural components of the diffusion layer are studied by the nanoindentation method, and the values of their plasticity index are established.

Keywords

• thermal diffusion layers
• brittleness
• intermetallic compounds
• copper aluminides
• heat resistance of copper