Highly efficient p-type doping of GaN under nitrogen-rich and low-temperature conditions by plasma-assisted molecular beam epitaxy

Abstract

Highly efficient and reproducible p-type doping of GaN under nitrogen-rich and low-growth-temperature conditions was demonstrated with the plasma-assisted molecular beam epitaxy technique. The low-temperature range is approximately below 650 °C and refers to growth temperatures at which the thermal desorption of any excess Ga is negligibly slow. The Mg and hole concentrations obtained with the N-rich condition were more than one order of magnitude higher than those obtained with the Ga-rich condition while keeping all other conditions identical. The Mg doping under such N-rich conditions was also found to show Mg-mediated suppression of background impurities, good epitaxy quality on GaN templates, and relatively low surface roughness. Over the investigated growth temperature range from 580 °C to 650 °C, the Mg incorporation efficiency under the N-rich condition was found to be close to unity (70%-80%) and independent of the growth temperature. High hole concentrations of up to 2×1019 cm-3 and activation efficiencies of up to 16.6% were obtained. The result rules out the Mg surface sticking probability as the limiting mechanism for Mg incorporation in this temperature range, as it would be temperature dependent. Instead, the Mg incorporation rate was more likely governed by the availability of substitutional sites for Mg on the surface, which should be abundant under the N-rich growth conditions. Excellent diode characteristics and electroluminescence results were observed when this p-type doping method was employed in the growth of full device structures.