Transient Thermal Analysis of MCM towards Understanding Failure Mechanism of Intermittent Faults

Abstract

Temperature fluctuation which can be treated as fault event has been recognized as a major cause of the intermittent faults (IFs). In order to investigate the failure mechanism of IFs correlated with temperature, the regulation of IF evolution through fault and reset events is studied and transient thermal analysis is carried out. Analysis result shows that the temperature of MCM is fluctuant due to the variations in the power input and the ambient temperature which may activate or deactivate IFs. Finally, temperature test is carried out to confirm the IFs phenomenon. This work can help in improving the thermal design and understanding the occurrence of IFs and, hence, in implementing IFs tolerance, diagnosis and recovery techniques.