PI Film Laser Micro-Cutting for Quantitative Manufacturing of Contact Spacer in Flexible Tactile Sensor

Abstract

The contact spacer is the core component of flexible tactile sensors, and the performance of this sensor can be adjusted by adjusting contact spacer micro-hole size. At present, the contact spacer was mainly prepared by non-quantifiable processing technology (electrospinning, etc.), which directly leads to unstable performance of tactile sensors. In this paper, ultrathin polyimide (PI) contact spacer was fabricated using nanosecond ultraviolet (UV) laser. The quality evaluation system of laser micro-cutting was established based on roundness, diameter and heat affected zone (HAZ) of the micro-hole. Taking a three factors, five levels orthogonal experiment, the optimum laser cutting process was obtained (pulse repetition frequency 190 kHz, cutting speed 40 mm/s, and RNC 3). With the optimal process parameters, the minimum diameter was 24.3 ± 2.3 μm, and the minimum HAZ was 1.8 ± 1.1 μm. By analyzing the interaction process between nanosecond UV laser and PI film, the heating-carbonization mechanism was determined, and the influence of process parameters on the quality of micro-hole was discussed in detail in combination with this mechanism. It provides a new approach for the quantitative industrial fabrication of contact spacers in tactile sensors.

Keywords

• laser micro-cutting
• PI film
• contact spacer
• tactile sensor