Study on silicon crystallization with aluminum deposition temperature in the aluminum-induced crystallization process using silicon oxide

Abstract

Aluminum-induced crystallization (AIC) is one process which increases silicon grain size at low temperatures. In this study, we analyzed the effect of silicon crystallization according to the aluminum deposition conditions in the AIC process using silicon oxide. The initial aluminum layer was analyzed using a field emission-scanning electron microscopy (FE-SEM) after cutting the samples with a focused-ion-beam (FIB). Through FE-SEM, we observed that the aluminum grain size of the original aluminum layer increased in proportion to the aluminum deposition temperature. However, not only aluminum grain size but also surface roughness and porosity of the initial aluminum layer were increased. The initial aluminum layer, according to the deposition temperature, significantly affected the crystallized silicon grain size. The silicon grain size was decreased from 16.97 μm to 7.81 μm according to the increase of the aluminum deposition temperature. This was because the Si diffusion area was increased by the increase of the aluminum surface roughness.