Low-Cost Internet of Things Solution for Building Information Modeling Level 3B—Monitoring, Analysis and Management

Abstract

The integration of the Internet of Things (IoT) and Building Information Modeling (BIM) is progressing. The use of microcontrollers and sensors in buildings is described as a level 3B maturity in the use of BIM. Design companies, contractors and building operators can use IoT solutions to monitor, analyze or manage processes. As a rule, solutions based on original Arduino boards are quite an expensive investment. The aim of this research was to find a low-cost IoT solution for monitoring, analysis and management, and integrate it with a BIM model. In the present study, an inexpensive NodeMCU microcontroller and a temperature and pressure sensor were used to study the thermal comfort of users in a single-family home. During the summer season, analysis of the monitored temperature can contribute to installation (HVAC) or retrofit work (for energy efficiency). The article presents a low-cost solution for studying the thermal comfort of users using a digital twin built-in BIM. Data obtained from sensors can support both the design and management processes. The main contribution of the article enables the design, construction and use of low-cost circuits (15.57 USD) even in small developments (single-family houses, semi-detached houses, terraced houses, atrium buildings). Combining IoT sensor telemetry with BIM (maturity level 3C) is a challenge that organizations will face in the near future.

Keywords

• BIM
• Building Information Modeling
• IoT
• Internet of Things
• thermal comfort
• single-family house