Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing

Abstract

In recent years, with the rapid development of the flexible electronics industry, there is an urgent need for a large-area, multilayer, and high-production integrated manufacturing technology for scalable and flexible electronic products. To solve this technical demand, researchers have proposed and developed microtransfer printing technology, which picks up and prints inks in various material forms from the donor substrate to the target substrate, successfully realizing the integrated manufacturing of flexible electronic products. This review retrospects the representative research progress of microtransfer printing technology for the production of flexible electronic products and emphasizes the summary of seal materials, the basic principles of various transfer technology and fracture mechanics models, and the influence of different factors on the transfer effect. In the end, the unique functions, technical features, and related printing examples of each technology are concluded and compared, and the prospects of further research work on microtransfer printing technology is finally presented.

Keywords

• flexible electronics
• microtransfer printing
• mechanical model
• PDMS seal
• SMP seal
• ink