Analysis and Verification of Heat Dissipation Structures Embedded in Substrates in Power Chips Based on Square Frustums Thermal through Silicon Vias

Abstract

A novel heat dissipation structure composed of square frustums thermal through silicon via array and embedded in P-type (100) silicon substrate is proposed to improve the heat dissipation capacity of power chips while reducing process difficulty. Based on theoretical analysis, the heat transfer model and thermo-electric coupling reliability model of a power chip with the proposed heat dissipation structure are established. A comparative study of simulation indicates that the proposed heat dissipation structure, which can avoid problems such as softness, poor rigidity, fragility and easy fracture caused by thinning chips has better heat dissipation capability than thinning the substrate of power chips.

Keywords

• thermal reliability
• thermal characteristics
• dissipative structure
• square frustums TTSV