Microstructure and finite element analysis of Mo2C-diamond/Cu composites by spark plasma sintering

Abstract

Mo2C layer was generated on the diamond surface via vacuum micro-evaporating, which was used as the reinforcement particles to fabricate diamond/Cu composites by spark plasma sintering (SPS). The effect of evaporation parameters on the forming of Mo2C, and the holding time on diamond/Cu composites fabrication is studied. Combined with the experiment and finite element analysis (FEA), the holding time on diamond/Cu composites influence on the thermal conductivity (TC) of composites is further discussed. The results show that the Mo2C area on the diamond surface would gradually enlarge and cover the diamond surface evenly with the increment in evaporation time and temperature, better vacuum micro-evaporating parameters were given as 1,000°C for 60 min. The fractures in the diamond/Cu composites are mainly ductile fractures on copper and diamond falling out from the Mo2C interface. It was found that sintering time would significantly influence the dissipation property of diamond/Cu composites. A comprehensive parameter for SPS was obtained at 900°C, 80 MPa for 10 min, the relative density (RD) and TC of the composites obtained under the parameter were 96.13% and 511 W/(m K). A longer sintering time would damage the Mo2C interlayer and further decrease the bonding between copper matrix and diamond particles, which would lower the RD and TC of composites. It can be obtained from the comparison of simulation results and experimental results that the FEA result is closer to the experimental results due to the gaps with low heat conduction, and the air in the gaps is added in the simulation process.

Keywords

• mo2c interlayer
• diamond/cu composites
• vacuum micro-evaporating
• sps
• thermal conductivity