Design of a High Sensitivity Pirani Gauge Based on Vanadium Oxide Film for High Vacuum Measurement

Abstract

We have designed a hot-plate-type micro-Pirani vacuum gauge with a simple structure and compatibility with conventional semiconductor fabrication processes. In the Pirani gauge, we used a vanadium oxide (VOx) membrane as the thermosensitive component, taking advantage of the high temperature coefficient of resistance (TCR) of VOx. The TCR value of VOx is −2%K−1∼−3%K−1, an order of magnitude higher than those of other thermal-sensitive materials, such as platinum and titanium (0.3%K−1∼0.4%K−1). On one hand, we used the high TCR of VOx to increase the Pirani sensitivity. On the other hand, we optimized the floating structure to decrease the thermal conductivity so that the detecting range of the Pirani gauge was extended on the low-pressure end. We carried out simulation experiments on the thermal zone of the Pirani gauge, the width of the cantilever beam, the material and thickness of the supporting layer, the thickness of the thermal layer (VOx), the depth of the cavity, and the shape and size. Finally, we decided on the basic size of the Pirani gauge. The prepared Pirani gauge has a thermal sensitive area of 130 × 130 μm2, with a cantilever width of 13 μm, cavity depth of 5 μm, supporting layer thickness of 300 nm, and VOx layer thickness of 110 nm. It has a dynamic range of 10−1~104 Pa and a sensitivity of 1.23 V/lgPa. The VOx Pirani was designed using a structure and fabrication process compatible with a VOx-based uncooled infrared microbolometer so that it can be integrated by wafer level. This work contains only our MEMS Pirani gauge device design, preparation process design, and readout circuit design, while the characterization and relevant experimental results will be reported in the future.

Keywords

• MEMS Pirani gauge
• vanadium oxide
• high TCR
• structure design
• fabrication process design
• simulation by COMSOL Multiphysics