Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors

Abstract

Electronic manufacturing principles are continuously developing, further improving assembly quality and productivity. There is a continuous need to apply novel and improved methods of process monitoring to provide accurate measurement and control during assembling. In this paper, a new principle for monitoring filmwise condensation-based heat-level—vapour phase soldering (HL-VPS) is presented to improve the process control. The experiment is based on thermocouple sensors in fusion with a sensitive gauge type pressure sensor. The aim is to precisely identify the steps of condensation-based reflow heat transfer process with commercially available components and the mindset of possible retrofitting in the generally used HL-VPS soldering ovens. It was found that the gauge sensor can follow the state of the workspace more precisely as the thermocouples, by monitoring the hydrostatic state of the vapour. The pressure (time) function gives information about the build-up of the vapour column, highlighting four characteristic steps (phases) of the process, meaning: immersion of the sample to be soldered, condensation-based heat transfer, solder-break, and cooling. Combined application with thermocouples enables more precise control, improving soldering quality and can reduce idle time of the oven. In addition, it was showed that the gauge type sensors could highlight any failure in the oven sealing by a sensor signal threshold detection. The original concept of workspace identification also fits the present and future industry 4.0 directives.

Keywords

• vapour phase soldering
• reflow soldering
• pressure profiles
• applied sensors