Correlation between crystallographic texture and electrochemical behavior of nano/ultrafine-grained AA2024 alloy processed by accumulative roll bonding process

Abstract

This study provides an insight into the correlation between crystallographic texture and electrochemical behavior of nano/ultrafine-grained AA2024 alloy. To achieve this objective, the following AA2024 alloys were processed by accumulative roll bonding (ARB): (i) Nano/ultrafine-grained AA2024 alloy with virtually the same grain size and the texture components of S {123}⟨634⟩, Cube {001}⟨100⟩, Copper {112}⟨111⟩, and Brass {011}⟨211⟩, and (ii) Bimodal-grained structure AA2024 alloy consisting of coarse and ultrafine elongated grains and the texture components of S {123}⟨634⟩ and Brass {011}⟨211⟩. The results indicated that the grain refinement increases the corrosion current density and decreases the passive film resistance of AA2024 alloy in quiescent phosphate buffer solution (pH = 9). Overall, electrochemical studies revealed that the uniform distribution of grain size and development of Cube {001}⟨100⟩ and Copper {112}⟨111⟩ texture components provide the most advantageous electrochemical properties. Hence, it was suggested that nano/ultrafine-grained structure was preferred compared to bimodal grain structure.

Keywords

• Accumulative roll bonding
• Nano/ultrafine-grained materials
• Microstructure characterization
• Crystallographic texture
• Electrochemical behavior