Inertial focusing in a parallelogram profiled microchannel over a range of aspect ratios

Abstract

Abstract In this study, particle focusing phenomena are studied in parallelogram and rectangular cross-sectioned microchannels of varying aspect ratio. In contrast to prior work the microchannels were fabricated using anisotropic wet etching of a Si wafer, plasma bonding, and self-alignment between the Si channel and the PDMS mold. It is shown that the inertial focusing points of the fabricated microchannels of parallelogram and rectangular cross-section were modified as the aspect ratio of the microchannels changed. The particle focusing points of the parallelogram profiled microchannel are compared with those of the rectangular microchannel through experimental measurements and CFD simulation. It is shown that particles can be efficiently focused and separated at a relatively low Reynolds number using a parallelogram profiled microchannel with a low aspect ratio.

Keywords

• Inertial focusing
• Parallelogram microchannel
• Anisotropic wet etching
• Self-alignment
• Aspect ratio