Advanced Characterization of a Hybrid Shielding Solution for Reducing Electromagnetic Interferences at Board Level

Jorge Victoria; Adrian Suarez; Pedro A. Martinez; Andrea Amaro; Antonio Alcarria; Jose Torres; Roberto Herraiz; Victor Solera; Víctor Martinez; Raimundo Garcia-Olcina

doi:10.3390/electronics13030598

Electronics (Jan 2024)

Advanced Characterization of a Hybrid Shielding Solution for Reducing Electromagnetic Interferences at Board Level

Jorge Victoria,
Adrian Suarez,
Pedro A. Martinez,
Andrea Amaro,
Antonio Alcarria,
Jose Torres,
Roberto Herraiz,
Victor Solera,
Víctor Martinez,
Raimundo Garcia-Olcina

Affiliations

Jorge Victoria: Department of Electronic Engineering, University of Valencia, 46100 Burjassot, Spain
Adrian Suarez: Department of Electronic Engineering, University of Valencia, 46100 Burjassot, Spain
Pedro A. Martinez: Department of Electronic Engineering, University of Valencia, 46100 Burjassot, Spain
Andrea Amaro: Department of Electronic Engineering, University of Valencia, 46100 Burjassot, Spain
Antonio Alcarria: Department of Electronic Engineering, University of Valencia, 46100 Burjassot, Spain
Jose Torres: Department of Electronic Engineering, University of Valencia, 46100 Burjassot, Spain
Roberto Herraiz: Department of Electronic Engineering, University of Valencia, 46100 Burjassot, Spain
Victor Solera: Department of Electronic Engineering, University of Valencia, 46100 Burjassot, Spain
Víctor Martinez: EMC Shielding & Grounding Team, Würth Elektronik eiSos, 74638 Waldenburg, Germany
Raimundo Garcia-Olcina: Department of Electronic Engineering, University of Valencia, 46100 Burjassot, Spain

DOI: https://doi.org/10.3390/electronics13030598
Journal volume & issue: Vol. 13, no. 3
p. 598

Abstract

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The development of new advanced functionalities, miniaturization, and the aim of obtaining optimized performance in electronic devices significantly impacts their electromagnetic compatibility (EMC). As electronic components become more densely packed on a printed circuit board (PCB), unintended coupling between components can cause electromagnetic interference (EMI). These requirements result in design restrictions that make using a board level shield (BLS) essential in reducing intra-system EMI in PCB designs. This contribution focuses on studying and characterizing a BLS solution based on combining a noise suppression sheet (NSS) with an aluminum layer to reduce intra-system EMI coupling. This hybrid solution has the advantage of providing a shielding option that does not require any electronic redesign. It does not need a footprint or a ground connection as it can be affixed over the EMI source. The solution is expected to provide higher attenuation levels than using only an NSS by combining the absorbing properties of the magnetic material and the loss mechanism of the metal. In order to verify the effectiveness of the hybrid BLS proposed solution, the magnetic near-field emissions of an EMI source are analyzed in this study. The experimental measurements and simulated results demonstrate a significant increase (51.6 dB at 1 GHz) in the shielding effectiveness (SE) provided by the proposed solution compared to a conventional NSS.

Published in Electronics

ISSN: 2079-9292 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Electronics
Website: http://www.mdpi.com/journal/electronics

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