Nanoarchitectonics of BN/AgNWs/Epoxy Composites with High Thermal Conductivity and Electrical Insulation

Abstract

To promote the construction of the thermal network in the epoxy resin (EP), a certain proportion of silver nanowires (AgNWs) coupled with the hexagonal boron nitride (BN) nanoplates were chosen as fillers to improve the thermal conductivity of EP resin. Before preparing the composites, BN was treated by silane coupling agent 3-aminopropyltriethoxysilane (KH550), and AgNWs was coated by dopamine hydrochloride. The BN/AgNWs/EP composites were prepared after curing, and the thermal conductivity and dielectric properties of the composites was tested. Results showed that the AgNWs and BN were uniformly dispersed in epoxy resin. It synergistically built a thermal network and greatly increased the thermal conductivity of the composites, which increased 9% after adding AgNWs. Moreover, the electrical property test showed that the addition of AgNWs had little effect on the dielectric constant and dielectric loss of the composites, indicating a rather good electrical insulation of the composites.

Keywords

• epoxy resin
• boron nitride
• silver nanowires
• thermal conductivity