Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder
Zhihuan Zhao,
Guanghao Gong,
Mingming Jiang,
Chuanzhong Chen,
Yingyue Pan,
Weili Liu,
Li Zhang
Affiliations
Zhihuan Zhao
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education) and Shandong Engineering Research Center for Superhard Material, Department of Materials Science and Engineering, Shandong University, Jinan 250061, China
Guanghao Gong
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education) and Shandong Engineering Research Center for Superhard Material, Department of Materials Science and Engineering, Shandong University, Jinan 250061, China
Mingming Jiang
School of Mechanical and Electronic Engineering, Shandong Agricultural and Engineering University, Jinan 250100, China
Chuanzhong Chen
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education) and Shandong Engineering Research Center for Superhard Material, Department of Materials Science and Engineering, Shandong University, Jinan 250061, China
Yingyue Pan
School of Mechanical and Electronic Engineering, Shandong Agricultural and Engineering University, Jinan 250100, China
Weili Liu
School of Mechanical and Electronic Engineering, Shandong Agricultural and Engineering University, Jinan 250100, China
Li Zhang
Jinan Semiconductor Research Institute, Jinan 250014, China
In this study, soldering is conducted between a chip and a CLCC-3 shell base with a sheet-like AuGa0.03 alloy solder as the encapsulating material. X-ray images of chip soldering samples, XRD diffraction analysis of the joints, SEM images reflecting the microstructures of the joints, and EDS of the cross sections of the chip soldering samples show that with gradually increasing soldering temperature, the phase composition is not affected, and all the joint structures are an Au + Si eutectic structure; the Au−Si eutectic reaction occurs during the soldering process. No deposition of meta-stable phases, such as Au7Si, Au5Si, or Au3S, is found. A soldering temperature of 420 °C can reduce the negative impacts of secondary cap welding soldering on the joint and improve the structure and mechanical properties of the joint.
