Xibei Gongye Daxue Xuebao (Dec 2023)
Thermal modeling of high-power satellite power cable and analysis of bundling thermal effect
Abstract
With the increase of satellite power, the current-carrying and heat dissipation of power cable is increasing significantly and the thermal safety problem becomes prominent. Therefore, the need for accurate modeling and fine design of power cable becomes increasingly urgent. In this paper, the thermal analysis modeling method for high-power cable bundle is proposed based on ground test data, and the heat transfer parameters at the installation and bundling points are obtained. At the same time, the thermal effect of cable bundling is quantitatively analyzed by simulating the splitting and binding power cable bundle. The result indicates that enhancing the radiation heat transfer between cables and the surrounding environment is the most effective means to improve the heat dissipation condition of cable bundles. The thermal model of high-power satellite power cable proposed in this paper can be used as an important basis for the prediction of on-orbit temperature and fine laying design of the power cable.
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