The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys
Qichao Hao,
Xinfu Tan,
Qinfen Gu,
Stuart D. McDonald,
Kazuhiro Nogita
Affiliations
Qichao Hao
Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia
Xinfu Tan
Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia
Qinfen Gu
Australian Synchrotron, ANSTO, Clayton, VIC 3168, Australia
Stuart D. McDonald
Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia
Kazuhiro Nogita
Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia
Sn–Bi-based, low-temperature solder alloys are being developed to offer the electronics manufacturing industry a path to lower temperature processes. A critical challenge is the significant microstructural and lattice parameter changes that these alloys undergo at typical service temperatures, largely due to the variable solubility of Bi during the Sn phase. The influence of alloying additions in improving the performance of these alloys is the subject of much research. This study aims to enhance the understanding of how alloying with In influences these properties, which are crucial for improving the alloy’s reliability. Using in situ heating synchrotron powder X-ray diffraction (PXRD), we investigated the Sn–57 wt% Bi–xIn (x = 0, 0.2, 0.5, 1, 3 wt%) alloys during heating and cooling. Our findings reveal that In modifies the microstructure, promoting more homogeneous Bi distribution during thermal cycling. This study not only provides new insights into the dissolution and precipitation behaviour of Bi in Sn–Bi-based alloys, but also demonstrates the potential of In to improve the thermal stability of these alloys. These innovations contribute significantly to advancing the performance and reliability of Sn–Bi-based, low-temperature solder alloys.
