Study of novel high-density solar panels based on small space interconnection technology

Abstract

Small space interconnection technology (SSIT) has been utilized in solar panels recently. The application of this technology can further increase the module efficiency. However, higher power decay after long-time operation may occur due to additional risk. Therefore, in this paper, damp heat (DH), thermal cycle (TC), UV irradiation and humidity freezing (HF) tests were utilized to study the weatherability performance of SSIT-based high-density solar panels fabricated with cells cut by two different techniques. The achieved data suggest that the novel high-density modules with small space between cells have good reliability in various weather conditions. The novel low-damage laser-induced cutting technique is beneficial for the improvement of module reliability.