A viscoplastic model for void growth under dynamic loading conditions

Abstract

We present a dynamic theoretical viscoplastic model of voids subjected to external dynamic tensile loadings. The material viscosity and temperature are factors that are considered in the dynamic evolution of voids in viscoplastic materials. We focus on the thermal effect; the temperature affects the thermal softening of the material strength and also the material viscosity. Viscous flow is the dominant growth mechanism under high stresses and rates based on the results of the calculations for dynamic void growth predictions. The factors are independently studied, and the correlations are systematically analyzed.