Nature Communications (May 2018)

Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions

  • Saranshu Singla,
  • Gaurav Amarpuri,
  • Nishad Dhopatkar,
  • Todd A. Blackledge,
  • Ali Dhinojwala

DOI
https://doi.org/10.1038/s41467-018-04263-z
Journal volume & issue
Vol. 9, no. 1
pp. 1 – 8

Abstract

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Spider aggregate glue avoids failure in humid environments but the fundamental mechanism behind it is still unknown. Here, the authors demonstrate that humidity-dependent structural changes of glycoproteins and sequestering of liquid water by low molecular mass compounds prevents adhesion failure of the glue in humid environments.